Invention Grant
- Patent Title: Substrate processing apparatus, substrate processing method and memory medium
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Application No.: US15421565Application Date: 2017-02-01
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Publication No.: US10528028B2Publication Date: 2020-01-07
- Inventor: Teruhiko Kodama , Masashi Enomoto
- Applicant: TOKYO ELECTRON LIMITED
- Applicant Address: JP Minato-ku
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Minato-ku
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2014-042707 20140305; JP2014-265759 20141226
- Main IPC: G06F19/00
- IPC: G06F19/00 ; G05B19/406 ; H01L21/66 ; G05B19/418 ; H01L21/302 ; H01L21/67 ; G05B23/02 ; H01L21/677

Abstract:
A substrate processing system includes a film-forming device to form photosensitive film on substrate, an exposure device to expose the film on the substrate, a relay device to transfer the substrate between the film-forming and exposure devices, a warping data acquisition device to acquire measured warping data of the substrate, a communication device to perform data communication with the exposure device, and a control device including film-forming, relay, measuring, and communication control sub-devices. The film-forming sub-device controls the film-forming device to form the film on the substrate, the relay sub-device controls the relay device to transfer the substrate to the exposure device, the measuring sub-device controls the warping data acquisition device to acquire the data after the controlling by the film-forming sub-device prior to the controlling by the relay sub-device, and the communication sub-device controls the communication device to transmit the data to the exposure device.
Public/Granted literature
- US20170139399A1 SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD AND MEMORY MEDIUM Public/Granted day:2017-05-18
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