Invention Grant
- Patent Title: Bundling application programming interfaces
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Application No.: US14198780Application Date: 2014-03-06
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Publication No.: US10528965B2Publication Date: 2020-01-07
- Inventor: Jim A. Laredo , Arjun Natarajan , Maja Vukovic
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Yee & Associates, P.C.
- Main IPC: G05B19/05
- IPC: G05B19/05 ; G06Q30/02 ; G06Q50/18

Abstract:
Bundling application programming interfaces is provided. Related application programming interfaces within a set of application programming interfaces and their corresponding dependent application programming interfaces are combined with related composite application programming interfaces within a set of composite application programming interfaces and their corresponding dependent application programming interfaces to generate a set of application programming interface bundles. The computer prunes the set of application programming interface bundles based on a determined application programming interface budget pattern that corresponds to a selected cluster of application programming interface consumers. The computer prices the pruned set of application programming interface bundles based on an application programming interface bundle pricing model.
Public/Granted literature
- US20150254701A1 Bundling Application Programming Interfaces Public/Granted day:2015-09-10
Information query
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