Invention Grant
- Patent Title: Memory chip, package device having the memory chips, and operating method of package device
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Application No.: US15984803Application Date: 2018-05-21
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Publication No.: US10529397B2Publication Date: 2020-01-07
- Inventor: Jin Yong Seong , Ho Jun Kang , Sang Bin Park
- Applicant: SK hynix Inc.
- Applicant Address: KR Gyeonggi-do
- Assignee: SK hynix Inc.
- Current Assignee: SK hynix Inc.
- Current Assignee Address: KR Gyeonggi-do
- Agency: IP & T Group LLP
- Priority: KR10-2017-0132066 20171012
- Main IPC: G11C8/06
- IPC: G11C8/06 ; G11C5/02 ; G11C5/04 ; G11C5/06 ; H01L23/00 ; H01L25/065

Abstract:
Provided herein may be a memory chip, a package device having the memory chip, and a method of operating the package device. The memory chip comprising a plurality of memory blocks each including a plurality of memory cells for storing data; a plurality of input/output pads to which a chip address is inputted; and a plurality of peripheral circuits configured to program the chip address to a selected memory block among the memory blocks.
Public/Granted literature
- US20190115052A1 MEMORY CHIP, PACKAGE DEVICE HAVING THE SAME, AND OPERATING METHOD THEREOF Public/Granted day:2019-04-18
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