Invention Grant
- Patent Title: Coil component and method for manufacturing the same
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Application No.: US15665263Application Date: 2017-07-31
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Publication No.: US10529476B2Publication Date: 2020-01-07
- Inventor: Ho Sik Park , Sang Jae Lee , Youn Soo Seo , Yong Sam Lee , Hye Yeon Cha , Jae Ha Kim
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2016-0163470 20161202
- Main IPC: H01F5/00
- IPC: H01F5/00 ; H01F5/04 ; H01F41/04

Abstract:
A coil component includes a body having a coil part disposed in the body. The coil part may include: a first coil pattern formed on one surface of the insulating layer; and a second coil pattern including an external pattern formed on the other surface of the insulating layer. The second coil pattern may further include an embedded pattern embedded in the insulating layer and the external pattern may be disposed on the embedded pattern. The coil component can have improved low direct current resistance characteristics and inductance.
Public/Granted literature
- US20180158584A1 COIL COMPONENT AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2018-06-07
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