Invention Grant
- Patent Title: Electronic component
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Application No.: US15828472Application Date: 2017-12-01
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Publication No.: US10529488B2Publication Date: 2020-01-07
- Inventor: Yukihiro Fujita , Takashi Fukuma
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2016-235075 20161202
- Main IPC: H01G4/30
- IPC: H01G4/30 ; H01G2/06 ; H01G4/232 ; H01G4/005 ; H01G4/12 ; H05K1/11 ; H05K1/18 ; H05K1/02

Abstract:
An electronic component includes a multilayer capacitor and an interposer including a substrate main body with an electric insulation property, the multilayer capacitor being mounted on one main surface side of the substrate main body. The multilayer capacitor includes a multilayer body, a first outer electrode, and a second outer electrode. The multilayer body includes an effective region and a non-effective region surrounding the effective region. A width of the effective region is larger than a width of the substrate main body, when a width of the multilayer body is represented by W11, a thickness of the multilayer body is represented by T11, and a thickness of the substrate main body is represented by T21, a value of W11/(T11+T21) is not less than about 0.90 and not more than about 1.10.
Public/Granted literature
- US20180158608A1 ELECTRONIC COMPONENT Public/Granted day:2018-06-07
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