The present invention is a film capacitor comprising a dielectric film and a metal layer, the dielectric film being a resin film obtained by stretching an unstretched film produced using a crystalline hydrogenated dicyclopentadiene ring-opening polymer, and heating the resulting stretched film, and the resin film having a softening point of 250 to 320° C., a thermal shrinkage ratio of 0.01 to 5.0% when heated at 200° C. for 10 minutes, a loss tangent (tan δ) of 0.0001 to 0.0010, and a coefficient of static friction of 0.01 to 1.00. The present invention provides a film capacitor that includes a resin film as a dielectric film, the resin film exhibiting excellent heat resistance, excellent withstand voltage properties, and excellent workability.