Invention Grant
- Patent Title: Semiconductor device, substrate, method for manufacturing semiconductor device, and method for manufacturing substrate
-
Application No.: US16055300Application Date: 2018-08-06
-
Publication No.: US10529558B2Publication Date: 2020-01-07
- Inventor: Johji Nishio , Tatsuo Shimizu , Mitsuhiro Kushibe
- Applicant: KABUSHIKI KAISHA TOSHIBA
- Applicant Address: JP Mintao-ku
- Assignee: KABUSHIKI KAISHA TOSHIBA
- Current Assignee: KABUSHIKI KAISHA TOSHIBA
- Current Assignee Address: JP Mintao-ku
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2018-020475 20180207
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H01L29/16 ; H01L21/04

Abstract:
According to one embodiment, a semiconductor device includes a first semiconductor region including a first compound including silicon and carbon, and a second semiconductor region including a second compound including silicon and carbon. The first semiconductor region includes first to third regions contacting the second semiconductor region. The third region is positioned between the first region and the second region. The first region and the second region include germanium. The third region does not include germanium, or a concentration of germanium in the third region is lower than a concentration of germanium in the first region and lower than a concentration of germanium in the second region.
Public/Granted literature
Information query
IPC分类: