Invention Grant
- Patent Title: Microwave heat treatment apparatus and microwave heat treatment method
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Application No.: US14550065Application Date: 2014-11-21
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Publication No.: US10529598B2Publication Date: 2020-01-07
- Inventor: Seokhyoung Hong , Taichi Monden , Yoshihiro Miyagawa , Masaki Koizumi
- Applicant: TOKYO ELECTRON LIMITED
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Nath, Goldberg & Meyer
- Agent Jerald L. Meyer
- Priority: JP2013-244684 20131127
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H05B6/64

Abstract:
A microwave heat treatment apparatus includes: a processing vessel configured to accommodate a substrate therein; a support member configured to rotatably support the substrate in the processing vessel; a microwave introduction device configured to generate a microwave for processing the substrate and introduce the microwave into the processing vessel; a first cooling gas introduction part installed to face a main surface of the substrate supported by the support member, the main surface being a target to be processed; a second cooling gas introduction part installed in a lateral side of the substrate supported by the support member; and a control unit configured to independently control the introduction of a cooling gas from the first cooling gas introduction part and the introduction of the cooling gas from the second cooling gas introduction part.
Public/Granted literature
- US20150144622A1 MICROWAVE HEAT TREATMENT APPARATUS AND MICROWAVE HEAT TREATMENT METHOD Public/Granted day:2015-05-28
Information query
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