Invention Grant
- Patent Title: Substrate position adjustment method, storage medium and substrate treatment system
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Application No.: US16026680Application Date: 2018-07-03
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Publication No.: US10529604B2Publication Date: 2020-01-07
- Inventor: Makoto Hayakawa
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Posz Law Group, PLC
- Priority: JP2017-138264 20170714
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/687 ; G03F7/16 ; G03F7/09 ; G06T7/00 ; G03F7/30
Abstract:
The method includes a step of executing a rotation treatment in a rotation treatment apparatus; a step of imaging a substrate on which the rotation treatment has been executed, in an inspection apparatus; a step of acquiring change amount information stored in advance, being information on an amount of change in orientation of the substrate while the substrate is moved from the rotation treatment apparatus to the inspection apparatus; a step of acquiring, as an execution result information, information on an execution result of the rotation treatment along a circumferential direction of the substrate, based on an imaging result in the inspection apparatus; and a step of correcting a position of the substrate at a time of the rotation treatment, based on the change amount information and the execution result information.
Public/Granted literature
- US20190019701A1 SUBSTRATE POSITION ADJUSTMENT METHOD, STORAGE MEDIUM AND SUBSTRATE TREATMENT SYSTEM Public/Granted day:2019-01-17
Information query
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