Invention Grant
- Patent Title: Barrier seal for electrostatic chuck
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Application No.: US15001291Application Date: 2016-01-20
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Publication No.: US10529611B2Publication Date: 2020-01-07
- Inventor: Yo-Yu Chang , Chun-Yao Huang
- Applicant: MFC SEALING TECHNOLOGY CO., LTD.
- Applicant Address: unknown New Taipei
- Assignee: MFC Sealing Technology Co., Ltd.
- Current Assignee: MFC Sealing Technology Co., Ltd.
- Current Assignee Address: unknown New Taipei
- Agency: Mayer & Williams PC
- Agent Alan D. Kamrath; Karin L. Williams
- Priority: TW104105259A 20150216
- Main IPC: H01L21/683
- IPC: H01L21/683 ; H01J37/32 ; F16J15/10

Abstract:
Provided is a barrier seal for an electrostatic chuck in the plasma etching process. The barrier seal comprises multiple sealing portions to block the connecting layer of the electrostatic chuck and the plasma gas. The groove of the electrostatic chuck may be completely filled by the barrier seal. Even one of the multiple sealing portions is destroyed in the plasma etching process by the plasma gas, the barrier seal still prevents leaking of the electrostatic chuck effectively. The barrier seal provides a buffer period for engineers to replace the damaged barrier seal before the leaking occurs. Danger of leaking caused by abrupt breaking of the barrier seal is reduced. Furthermore, the barrier seal facilitates stability and safety of the plasma etching process. The yield of products manufactured by the electrostatic chuck may be improved.
Public/Granted literature
- US20160240421A1 Barrier Seal for Electrostatic Chuck Public/Granted day:2016-08-18
Information query
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