The method of manufacturing a light emitting element includes: temporarily fixing a semiconductor layer of a wafer including a base member and the semiconductor layer to a support base member by a double-sided tape having a loss tangent adapted to be increased by heating from an ordinary temperature; forming a cleavage starting portion for dividing the wafer into a plurality of light emitting elements at an ordinary temperature in the wafer; and singulating the wafer into a plurality of light emitting elements on the support base member while the double-sided tape is heated.