An apparatus for manufacturing a thermoelectric module is provided. The thermoelectric module includes thermoelectric pellets, first electrodes, second electrodes, and an insulating substrate. The apparatus includes a fixing tray to which the thermoelectric module is fixed, a first die including a first heating member configured to heat a first adhesive layer, which is interposed between the thermoelectric pellets and the first electrodes. The fixing tray is mounted on the first die such that the insulating substrate faces the first heating member. A second die includes a second heating member configured to heat a second adhesive layer, which is interposed between the thermoelectric pellets and the second electrodes, the second die facing the second electrodes. A transfer unit is configured to transfer at least one of the first die and the second die to adjust a distance between the first die and the second die.