Invention Grant
- Patent Title: Wire support for a leadframe
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Application No.: US16143148Application Date: 2018-09-26
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Publication No.: US10529654B2Publication Date: 2020-01-07
- Inventor: Yuh-Harng Chien , Chih-Chien Ho , Steven Su
- Applicant: TEXAS INSTRUMENTS INCORPORATED
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Agent Rose Alyssa Keagy; Charles A. Brill; Frank D. Cimino
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/31 ; H01L23/498 ; H01L23/00 ; H01L25/065 ; H01L25/18 ; H01L21/56
Abstract:
A leadframe includes a plurality of interconnected support members. A pair of die pads is connected to the support members and configured to receive a pair of dies electrically connected by at least one wire. A support bracket extends between the die pads and includes a surface for maintaining the at least one wire at a predetermined distance from the die pads during overmolding of the leadframe.
Public/Granted literature
- US20190027429A1 Wire Support For A Leadframe Public/Granted day:2019-01-24
Information query
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