Invention Grant
- Patent Title: Method of forming a packaged semiconductor device having enhanced wettable flank and structure
-
Application No.: US16229077Application Date: 2018-12-21
-
Publication No.: US10529655B2Publication Date: 2020-01-07
- Inventor: Pedro Joel Rivera-Marty
- Applicant: Amkor Technology, Inc.
- Applicant Address: US AZ Tempe
- Assignee: Amkor Technology, Inc.
- Current Assignee: Amkor Technology, Inc.
- Current Assignee Address: US AZ Tempe
- Agent Kevin B. Jackson
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/498 ; H01L23/31 ; H01L23/00 ; H01L21/48 ; H01L21/56
Abstract:
A packaged electronic device includes a substrate having a lead. The lead includes an outward facing side surface having a first height, and an inward facing side surface having a second height that is less than the first height. An electronic device is electrically connected to the lead. A package body encapsulates the electronic device and portions of the lead. The outward facing side surface is exposed through a side surface of the package body, and the inward facing side surface is encapsulated by the package body. A conductive layer is disposed on the outward facing side surface to provide the packaged electronic device with an enhanced wettable flank. In one embodiment, the electronic device is electrically connected to a thick terminal portion having the outward facing side surface. In another embodiment, the electronic device is electrically connected to a thin terminal portion having the inward facing side surface.
Public/Granted literature
- US20190148270A1 METHOD OF FORMING A PACKAGED SEMICONDUCTOR DEVICE HAVING ENHANCED WETTABLE FLANK AND STRUCTURE Public/Granted day:2019-05-16
Information query
IPC分类:
