Invention Grant
- Patent Title: Packaged semiconductor devices, methods of packaging semiconductor devices, and PoP devices
-
Application No.: US16100321Application Date: 2018-08-10
-
Publication No.: US10529673B2Publication Date: 2020-01-07
- Inventor: Po-Hao Tsai , Jui-Pin Hung , Jing-Cheng Lin
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company
- Current Assignee: Taiwan Semiconductor Manufacturing Company
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/498 ; H01L25/10 ; H01L21/48 ; H01L23/538 ; H01L21/78 ; H01L21/56 ; H01L25/00 ; H01L23/31
Abstract:
A packaged semiconductor device includes a substrate and a contact pad disposed on the semiconductor substrate. The packaged semiconductor device also includes a dielectric layer disposed over the contact pad, the dielectric layer including a first opening over the contact pad, and an insulator layer disposed over the dielectric layer, the insulator layer including a second opening over the contact pad. The packaged semiconductor device also includes a molding material disposed around the substrate, the dielectric layer, and the insulator layer and a wiring over the insulator layer and extending through the second opening, the wiring being electrically coupled to the contact pad.
Public/Granted literature
- US20180350756A1 Packaged Semiconductor Devices, Methods of Packaging Semiconductor Devices, and PoP Devices Public/Granted day:2018-12-06
Information query
IPC分类:
