- Patent Title: Encapsulated electronic device mounted on a redistribution layer
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Application No.: US15485235Application Date: 2017-04-12
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Publication No.: US10529680B2Publication Date: 2020-01-07
- Inventor: Bau-Ru Lu , Ming-Chia Wu
- Applicant: CYNTEC CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: CYNTEC CO., LTD
- Current Assignee: CYNTEC CO., LTD
- Current Assignee Address: TW Hsinchu
- Agency: Litron Patent & Trademark Office
- Agent Ming-Lee Teng
- Main IPC: H01L23/34
- IPC: H01L23/34 ; H01L23/28 ; H01L21/00 ; H01L21/4763 ; H01L23/00 ; H01L23/538 ; H01L21/683 ; H01L21/56 ; H05K3/28 ; H01L23/31 ; H01L23/552 ; H05K1/02
Abstract:
A substrateless device comprises a plurality of first conductive elements and an encapsulant. The encapsulant encapsulates the plurality of first conductive elements, wherein the locations of the plurality of first conductive elements are fixed by the encapsulant; and a plurality of terminals of the plurality of first conductive elements are exposed outside the encapsulant, wherein the plurality of first conductive elements are not supported by a substrate.
Public/Granted literature
- US20170221849A1 ENCAPSULATED ELECTRONIC DEVICE MOUNTED ON A REDISTRIBUTION LAYER Public/Granted day:2017-08-03
Information query
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