Apparatus and method for transfering semiconductor devices from a substrate and stacking semiconductor devices on each other

Invention Grant

US10529685B2 Apparatus and method for transfering semiconductor devices from a substrate and stacking semiconductor devices on each other 有权

Patent Title: Apparatus and method for transfering semiconductor devices from a substrate and stacking semiconductor devices on each other
Application No.: US15891018

Application Date: 2018-02-07
Publication No.: US10529685B2

Publication Date: 2020-01-07
Inventor: Andrew Huska , Cody Peterson
Applicant: Rohinni, LLC
Applicant Address: US ID Coeur d'Alene
Assignee: Rohinni, LLC
Current Assignee: Rohinni, LLC
Current Assignee Address: US ID Coeur d'Alene
Agency: Lee & Hayes, P.C.
Main IPC: H01L21/683
IPC: H01L21/683 ; H01L23/00

Abstract:

An apparatus including components to stack semiconductor device die.

Public/Granted literature

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Espacenet

IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L21/00	专门适用于制造或处理半导体或固体器件或其部件的方法或设备
H01L21/67	.专门适用于在制造或处理过程中处理半导体或电固体器件的装置；专门适合于在半导体或电固体器件或部件的制造或处理过程中处理晶片的装置
H01L21/683	..用于支承或夹紧的（用于定位、定向或对准的入H01L21/68）