Invention Grant
- Patent Title: Semiconductor device
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Application No.: US15971483Application Date: 2018-05-04
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Publication No.: US10529712B2Publication Date: 2020-01-07
- Inventor: Sung Min Kim , Dong Won Kim
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-Do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-Do
- Agency: F. Chau & Associates, LLC
- Priority: KR10-2017-0147238 20171107; KR10-2017-0165794 20171205
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L27/088 ; H01L23/528 ; H01L27/02 ; H01L29/08 ; H01L21/8234 ; H01L29/66 ; H01L29/417 ; H01L21/762 ; H01L23/485 ; H01L21/02 ; H01L21/027 ; H01L21/3065 ; H01L21/308 ; H01L21/311

Abstract:
A semiconductor device includes a substrate, a fin structure protruding from the substrate in a direction perpendicular to an upper surface of the substrate, the fin structure including first fin regions extending in a first direction and second fin regions extending in a second direction different from the first direction, source/drain regions disposed on the fin structure, a gate structure intersecting the fin structure, a first contact connected to one of the source/drain regions, and a second contact connected to the gate structure and being between the second fin regions in plan view.
Public/Granted literature
- US20190139955A1 SEMICONDUCTOR DEVICE Public/Granted day:2019-05-09
Information query
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