Invention Grant
- Patent Title: Semiconductor device
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Application No.: US16309504Application Date: 2017-06-02
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Publication No.: US10529799B2Publication Date: 2020-01-07
- Inventor: Masayuki Furuhashi , Kohei Ebihara
- Applicant: Mitsubishi Electric Corporation
- Applicant Address: JP Chiyoda-ku
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Chiyoda-ku
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2016-155446 20160808
- International Application: PCT/JP2017/020604 WO 20170602
- International Announcement: WO2018/029951 WO 20180215
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/06 ; H01L29/417 ; H01L29/16 ; H01L29/08 ; H01L21/04 ; H01L29/36 ; H01L29/10 ; H01L21/02 ; H01L29/49

Abstract:
A semiconductor device includes a semiconductor substrate, and a semiconductor layer disposed on the semiconductor substrate. First and second pillar layers, of respective first and second conductivity types, are alternately provided in a direction in parallel with a main surface in an active region of the semiconductor layer and in a termination region. A pillar pitch in the termination region is set to be larger than a pillar pitch in the active region. A product of a width of one of the first pillar layers and effective impurity concentration of the first conductivity of the one of the first pillar layers is equal to a product of a width of one of the second pillar layers and effective impurity concentration of the second conductivity of the one of the second pillar layers.
Public/Granted literature
- US20190333988A1 SEMICONDUCTOR DEVICE Public/Granted day:2019-10-31
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