Invention Grant
- Patent Title: FinFET with merge-free fins
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Application No.: US15913194Application Date: 2018-03-06
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Publication No.: US10529858B2Publication Date: 2020-01-07
- Inventor: Hong He , Chiahsun Tseng , Junli Wang , Chun-chen Yeh , Yunpeng Yin
- Applicant: GLOBALFOUNDRIES INC.
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES INC.
- Current Assignee: GLOBALFOUNDRIES INC.
- Current Assignee Address: KY Grand Cayman
- Agency: Roberts Mlotkowski Safran Cole & Calderon, P.C.
- Agent Michael Le Strange; Andrew M. Calderon
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/78 ; H01L29/423 ; H01L29/786 ; H01L29/06

Abstract:
A semiconductor device comprises an insulation layer, an active semiconductor layer formed on an upper surface of the insulation layer, and a plurality of fins formed on the insulation layer. The fins are formed in the gate and spacer regions between a first source/drain region and second source/drain region, without extending into the first and second source/drain regions.
Public/Granted literature
- US20180197980A1 FINFET WITH MERGE-FREE FINS Public/Granted day:2018-07-12
Information query
IPC分类: