An electronic signal processing device includes a printed circuit board, a signal processing chip, a plurality of conductive lines, a plurality of copper pads, and a fixing device. The signal processing chip is mounted on the printed circuit board, and a plurality of conductive lines are formed on the printed circuit board and connected to the signal processing chip. The copper pads are respectively formed at the ends of the conductive lines. The fixing device is fixed on the printed circuit board and exposes the copper pads to connect to a cable assembly so as to improve signal integrity.