An apparatus for providing a temporary electrical grounding connection is described. The apparatus comprises a cable electrically joining first and second conductive couplings, the first and second conductive couplings each electrically coupled to a conductive surface using a clamp, magnetic component, or other connection component. A conductive coupling may be connected to the magnetic component using a clamp connected to a stub extending from the magnetic component, and there may be multiple clamps or magnetic components used in different combinations or series to provide an electrical bypass between two or more conductive surfaces.