Invention Grant
- Patent Title: Solid-state image pickup device, manufacturing method therefor, and electronic apparatus
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Application No.: US15773835Application Date: 2016-11-04
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Publication No.: US10531020B2Publication Date: 2020-01-07
- Inventor: Kenichi Murata
- Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Applicant Address: JP Kanagawa
- Assignee: Sony Semiconductor Solutions Corporation
- Current Assignee: Sony Semiconductor Solutions Corporation
- Current Assignee Address: JP Kanagawa
- Agency: Sheridan Ross P.C.
- Priority: JP2015-225377 20151118
- International Application: PCT/JP2016/082738 WO 20161104
- International Announcement: WO2017/086180 WO 20170526
- Main IPC: H04N5/349
- IPC: H04N5/349 ; H04N5/369 ; H01L27/146

Abstract:
The present disclosure relates to a solid-state image pickup device, a manufacturing method therefor, and an electronic apparatus that enables further miniaturization of a solid-state image pickup device to be achieved. A lower electrode is provided in each of pixels so as to hold a photoelectric conversion film including an organic material between the lower electrode and an upper electrode, and an isolation region is disposed to isolate the lower electrodes of the pixels from each other and includes at least a fixed charge film. The isolation region is formed by the fixed charge film that is formed more deeply than the thickness of the lower electrode. The present technology is, for example, applicable to a solid-state image pickup device having an organic photoelectric conversion film.
Public/Granted literature
- US20180324369A1 SOLID-STATE IMAGE PICKUP DEVICE, MANUFACTURING METHOD THEREFOR, AND ELECTRONIC APPARATUS Public/Granted day:2018-11-08
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