Thermoresponsive skin barrier assemblies are disclosed. One such wound treatment assembly includes a pump configured to expel a biosealant to a pump output port when subjected to a thermal stimulus, and an adhesive substrate layer for covering the wound. The adhesive substrate layer includes a conduit configured to transport the biosealant from the output port to the wound. The assembly further includes a control module in signal communication with a wound leakage sensor configured to activate a heating element disposed in proximity to the pump when wound leakage is detected.