- Patent Title: Thin film production method and organic el device production method
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Application No.: US15764575Application Date: 2016-09-06
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Publication No.: US10532374B2Publication Date: 2020-01-14
- Inventor: Motoo Noda , Hidekazu Shiomi , Akihide Suzuki
- Applicant: SUMITOMO CHEMICAL COMPANY, LIMITED
- Applicant Address: JP Chuo-ku, Tokyo
- Assignee: SUMITOMO CHEMICAL CO., LTD.
- Current Assignee: SUMITOMO CHEMICAL CO., LTD.
- Current Assignee Address: JP Chuo-ku, Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2015-194859 20150930
- International Application: PCT/JP2016/076183 WO 20160906
- International Announcement: WO2017/056875 WO 20170406
- Main IPC: H01L51/00
- IPC: H01L51/00 ; H01L51/56 ; H01L51/50 ; B05C5/02

Abstract:
A thin film production method according to one embodiment includes: a coating film forming step of forming a coating film by discharging a coating liquid on a support from first to M-th line heads (M is 2 or larger and N or smaller) while allowing the support to pass through N line heads once; and a drying step of obtaining a thin film by drying the coating film. A thin film forming nozzle hole 28 of the m-th line head (m is 2 or larger and M or smaller) is arranged to be positioned between adjacent thin film forming nozzle holes in an (m−1)-th thin film forming nozzle hole array Qm-1. Every time the first line head discharges the coating liquid, the m-th line head applies the coating liquid onto the support at a predetermined delay time with respect to a discharge time of the first line head. The first to M-th line heads discharge the coating liquid from the film forming nozzle hole selected in accordance with a shape of a thin film formation region onto the support.
Public/Granted literature
- US20190054494A1 THIN FILM PRODUCTION METHOD AND ORGANIC EL DEVICE PRODUCTION METHOD Public/Granted day:2019-02-21
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