- Patent Title: Porous copper sintered material, porous copper composite part, method of producing porous copper sintered material, and method of producing porous copper composite part
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Application No.: US15518902Application Date: 2015-10-21
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Publication No.: US10532407B2Publication Date: 2020-01-14
- Inventor: Koichi Kita , Koji Hoshino , Toshihiko Saiwai , Jun Katoh
- Applicant: MITSUBISHI MATERIALS CORPORATION
- Applicant Address: JP Tokyo
- Assignee: MITSUBISHI MATERIALS CORPORATION
- Current Assignee: MITSUBISHI MATERIALS CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Locke Lord LLP
- Priority: JP2014-215339 20141022
- International Application: PCT/JP2015/079687 WO 20151021
- International Announcement: WO2016/063905 WO 20160428
- Main IPC: B32B15/02
- IPC: B32B15/02 ; B22F7/00 ; B22F1/00 ; B22F3/11
Abstract:
A porous copper sintered material (10) includes: a plurality of copper fibers (11) sintered each other, wherein the copper fibers (11) are made of copper or copper alloy, a diameter R of the copper fibers (11) is in a range of 0.02 mm or more and 1.0 mm or less, and a ratio L/R of a length L of the copper fibers to the diameter R is in a range of 4 or more and 2500 or less (11), redox layers (12) formed by redox treatment are provided on surfaces of copper fibers (11, 11), and concavities and convexities are formed by the redox layer (12), and each of redox layers (12, 12) formed on each of the copper fibers (11) is integrally bonded in a junction of the copper fibers (11).
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