Invention Grant
- Patent Title: Polyamide resin composition
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Application No.: US13583234Application Date: 2011-03-08
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Publication No.: US10533089B2Publication Date: 2020-01-14
- Inventor: Akio Miyamoto , Yasuharu Fukui
- Applicant: Akio Miyamoto , Yasuharu Fukui
- Applicant Address: JP Ube-Shi, Yamaguchi
- Assignee: UBE INDUSTRIES, LTD.
- Current Assignee: UBE INDUSTRIES, LTD.
- Current Assignee Address: JP Ube-Shi, Yamaguchi
- Agency: Buchanan, Ingersoll & Rooney PC
- Priority: JP2010-051180 20100308; JP2010-051181 20100308; JP2010-051182 20100308
- International Application: PCT/JP2011/055409 WO 20110308
- International Announcement: WO2011/111713 WO 20110915
- Main IPC: C08L77/00
- IPC: C08L77/00 ; C08L77/06

Abstract:
A polyamide resin composition comprising a polyamide resin (A), glass (C), and optionally a styrene polymer (B1) and a modified PPE (B2), wherein the total amount of A, B1, and B2 and the amount of C are, respectively, 40 to 95% by weight and 60 to 5% by weight, based on the weight of the composition, wherein the amount of A and the total amount of B1 and B2 are, respectively, 50 to 100% by weight and 50 to 0% by weight, based on 100% by weight of the whole of A, B1, and B2, wherein when C contains glass containing no boron oxide (C1), the amount of C1 is 60 to 5% by weight, based on the weight of the composition, wherein when C does not contain C1, A is a polyoxamide resin, or the amount of A and the total amount of B1 and B2 are defined.
Public/Granted literature
- US20130072622A1 POLYAMIDE RESIN COMPOSITION Public/Granted day:2013-03-21
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