Invention Grant
- Patent Title: Two-step process for forming cured polymeric films for electronic device encapsulation
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Application No.: US16050000Application Date: 2018-07-31
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Publication No.: US10533104B2Publication Date: 2020-01-14
- Inventor: Brian E. Lassiter , Lorenza Moro , Teresa A. Ramos , Elizabeth Tai , Alonso Serrato , Vera Steinmann
- Applicant: Kateeva, Inc.
- Applicant Address: US CA Newark
- Assignee: Kateeva, Inc.
- Current Assignee: Kateeva, Inc.
- Current Assignee Address: US CA Newark
- Agent Paula J. Tostado
- Main IPC: C09D11/101
- IPC: C09D11/101 ; C09D11/107 ; H01L51/56 ; H01L51/52
Abstract:
Methods for increasing the degree of curing and/or reducing the volatile photoinitiator concentration in cured polymeric film, and particularly in cured polymeric films in a multilayered thin film encapsulation stack are provided. Also provided are highly crosslinked and/or low-outgassing thin polymeric films and encapsulation stacks made using the methods.
Public/Granted literature
- US20190136075A1 Two-Step Process for Forming Cured Polymeric Films for Electronic Device Encapsulation Public/Granted day:2019-05-09
Information query
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