Invention Grant
- Patent Title: Feedback device and method of providing thermal feedback using the same
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Application No.: US15858351Application Date: 2017-12-29
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Publication No.: US10533780B2Publication Date: 2020-01-14
- Inventor: Kyoung Soo Yi , Ock Kyun Oh , Se Hwan Lim
- Applicant: TEGway Co., Ltd.
- Applicant Address: KR Daejeon
- Assignee: TEGWAY CO., LTD.
- Current Assignee: TEGWAY CO., LTD.
- Current Assignee Address: KR Daejeon
- Agency: Maschoff Brennan
- Priority: KR10-2017-0111462 20170831; KR10-2017-0111463 20170831; KR10-2017-0111464 20170831; KR10-2017-0111465 20170831; KR10-2017-0111466 20170831; KR10-2017-0111467 20170831
- Main IPC: F25B21/04
- IPC: F25B21/04 ; A41D1/00

Abstract:
Disclosed herein are a feedback device and a method of providing thermal feedback using the same. The feedback device according to an embodiment of the present disclosure includes a thermoelectric module including a substrate having flexibility, a thermoelement disposed on the substrate and configured to perform a thermoelectric operation for thermal feedback, and a contact surface disposed on the substrate, and configured to transfer heat generated through the thermoelectric operation to a user through the substrate and the contact surface to output the thermal feedback; and a feedback controller configured to control the thermoelectric module, and wherein the feedback controller controls the thermoelectric module so that, after a temperature of the contact surface reaches a maximum temperature, the temperature of the contact surface is maintained within a predetermined temperature range during an entire thermoelectric operation time interval.
Public/Granted literature
- US20190063797A1 FEEDBACK DEVICE AND METHOD OF PROVIDING THERMAL FEEDBACK USING THE SAME Public/Granted day:2019-02-28
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