Invention Grant
- Patent Title: Miniature gas sensor and method for manufacturing the same
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Application No.: US15370384Application Date: 2016-12-06
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Publication No.: US10533962B2Publication Date: 2020-01-14
- Inventor: Yu-Jen Hsiao , Ting-Jen Hsueh , Yu-Te Lin , Yen-Hsi Li , Jia-Min Shieh , Chien-Wei Liu , Chi-Wei Chiang
- Applicant: NATIONAL APPLIED RESEARCH LABORATORIES
- Applicant Address: TW Taipei
- Assignee: National Applied Research Laboratories
- Current Assignee: National Applied Research Laboratories
- Current Assignee Address: TW Taipei
- Agency: Rosenberg, Klein & Lee
- Priority: TW105125077A 20160805
- Main IPC: G01N27/12
- IPC: G01N27/12 ; G01N33/00

Abstract:
The present invention provides a gas sensor structure comprising a gas sensing chip. The back of the sensing material is a hollow structure. An insulating layer is below the sensing material. A micro heating is disposed surrounding the sensing material. The sensing material adheres to sensing electrodes. The sensing material is a complex structure including a metal oxide semiconductor and a roughened lanthanum-carbonate gas sensing layer. The thickness of the metal oxide semiconductor is between 0.2 μm and 10 μm; the thickness of the roughened lanthanum-carbonate gas sensing layer is between 0.1 μm and 4 μm; and the size of the back etching holes is smaller than 1*1 mm. By using the gas sensor structure according to the present invention, a suspended gas sensing structure can be fabricated on a silicon substrate and the chip size can be minimized.
Public/Granted literature
- US20180038816A1 MINIATURE GAS SENSOR AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2018-02-08
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