Invention Grant
- Patent Title: Module board coupling
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Application No.: US16068094Application Date: 2015-12-22
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Publication No.: US10534138B2Publication Date: 2020-01-14
- Inventor: Kevin B. Leigh , Sunil Ganta , John Norton , George D. Megason
- Applicant: Hewlett Packard Enterprise Development LP
- Applicant Address: US TX Houston
- Assignee: Hewlett Packard Enterprise Development
- Current Assignee: Hewlett Packard Enterprise Development
- Current Assignee Address: US TX Houston
- Agency: Brooks, Cameron & Huebsch, PLLC
- International Application: PCT/US2015/067409 WO 20151222
- International Announcement: WO2017/111947 WO 20170629
- Main IPC: G02B6/36
- IPC: G02B6/36 ; G02B6/42 ; H04B10/40

Abstract:
In one example, a system for a module board coupling includes a module bracket coupled to a plate, a module board coupled to the plate, a number of frame pins coupled to the module frame to slide under the plate when a back spring coupled to the module bracket is depressed, wherein the module board is engaged with a socket when the number of frame pins slide under the plate.
Public/Granted literature
- US20190018199A1 MODULE BOARD COUPLING Public/Granted day:2019-01-17
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