Invention Grant
- Patent Title: Single-mode polymer waveguide connector assembly device
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Application No.: US16285750Application Date: 2019-02-26
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Publication No.: US10534140B2Publication Date: 2020-01-14
- Inventor: Tymon Barwicz , Hidetoshi Numata
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Tutunjian & Bitetto, P.C.
- Agent Vazken Alexanian
- Main IPC: G02B6/38
- IPC: G02B6/38 ; G02B6/30 ; G02B6/122

Abstract:
Methods of forming waveguide connectors include positioning a polymer waveguide in one or more insertion structures within an inner portion of a cap where the polymer waveguide has alignment features on a connection end face corresponding to one or more components of an assembled connector. The method can include inserting a ferrule into the inner portion of the cap such that an inner wall of the cap seals around the assembled connector to prevent contaminants from entering the inner portion and heating the polymer waveguide and the ferrule to a first temperature with the ferrule comprising alignment features and having a different coefficient of thermal expansion from the polymer waveguide. The alignment features of the polymer waveguide align with the alignment features of the ferrule when the polymer waveguide and the ferrule are heated to the first temperature.
Public/Granted literature
- US20190187384A1 SINGLE-MODE POLYMER WAVEGUIDE CONNECTOR ASSEMBLY DEVICE Public/Granted day:2019-06-20
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