Invention Grant
- Patent Title: Hot swapping technique for expansion cards
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Application No.: US16140507Application Date: 2018-09-24
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Publication No.: US10534409B2Publication Date: 2020-01-14
- Inventor: Dwight Looi
- Applicant: Super Micro Computer, Inc.
- Applicant Address: US CA San Jose
- Assignee: SUPER MICRO COMPUTER, INC.
- Current Assignee: SUPER MICRO COMPUTER, INC.
- Current Assignee Address: US CA San Jose
- Agency: Artegis Law Group, LLP
- Main IPC: G06F1/18
- IPC: G06F1/18 ; H05K1/02

Abstract:
One embodiment of the present disclosure set forth a system for hot swapping an expansion card. The system includes a fastener mechanism for coupling an expansion card to a motherboard. The system further includes a switch for controlling voltage supply to the expansion card. When the fastener mechanism is in an activated state, the fastener mechanism secures the expansion card to the motherboard and the switch causes voltage to be supplied to the expansion card. When the fastener mechanism is in a partially activated state, the fastener mechanism secures the expansion card to the motherboard and the switch prevents voltage from being supplied to the expansion card.
Public/Granted literature
- US20190056769A1 HOT SWAPPING TECHNIQUE FOR EXPANSION CARDS Public/Granted day:2019-02-21
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