Invention Grant
- Patent Title: Angled device bay card assembly
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Application No.: US15940400Application Date: 2018-03-29
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Publication No.: US10534410B2Publication Date: 2020-01-14
- Inventor: Omar Ali Ali , Rodrigo Samper , Marc Richard Pamley , Alan Ladd Painter
- Applicant: Lenovo (Singapore) Pte. Ltd.
- Applicant Address: SG Singapore
- Assignee: Lenovo (Singapore) Pte. Ltd.
- Current Assignee: Lenovo (Singapore) Pte. Ltd.
- Current Assignee Address: SG Singapore
- Agent Brian J. Pangrle
- Main IPC: G06F1/18
- IPC: G06F1/18 ; G06F13/42 ; G06F1/20

Abstract:
A card assembly includes a card that includes a first edge and an opposing second edge, where the first edge includes an edge connector; and device sockets mounted to the card and operatively coupled to the edge connector, where each of the device sockets defines an end of a respective device bay, where each of the device bays is disposed at an angle of approximately 25 degrees to approximately 75 degrees with respect to the edge connector.
Public/Granted literature
- US20190302858A1 ANGLED DEVICE BAY CARD ASSEMBLY Public/Granted day:2019-10-03
Information query