Invention Grant
- Patent Title: Coil component
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Application No.: US15290172Application Date: 2016-10-11
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Publication No.: US10535459B2Publication Date: 2020-01-14
- Inventor: Chan Yoon , Dong Hwan Lee , Young Ghyu Ahn
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2016-0019464 20160219
- Main IPC: H01F17/00
- IPC: H01F17/00

Abstract:
A coil component includes: a body having coil portions disposed therein and exposed to one or more of surfaces of the body opposing each other in a width direction; external electrodes disposed on external surfaces of the body and connected to the coil portions; and insulating layers further disposed on the exposed coil portions.
Public/Granted literature
- US20170243689A1 COIL COMPONENT Public/Granted day:2017-08-24
Information query
IPC分类:
H | 电学 |
H01 | 基本电气元件 |
H01F | 磁体;电感;变压器;磁性材料的选择 |
H01F17/00 | 信号类型的固定电感器 |