Invention Grant
- Patent Title: Semiconductor device and method of forming the same
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Application No.: US15954305Application Date: 2018-04-16
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Publication No.: US10535686B2Publication Date: 2020-01-14
- Inventor: Victor Chiang Liang , Fu-Huan Tsai , Fang-Ting Kuo , Meng-Chang Ho , Yu-Lin Wei , Chi-Feng Huang
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Hauptman Ham, LLP
- Main IPC: H01L27/108
- IPC: H01L27/108 ; H01L27/146 ; H01L29/66 ; H01L27/07 ; H01L29/93

Abstract:
A semiconductor device includes a substrate, wherein the substrate includes a channel region. The semiconductor device further includes an isolation feature in the substrate. The isolation feature includes a first portion in the substrate, and a second portion extending along a top surface of the substrate. The second portion partially covers the channel region. The semiconductor device further includes a gate structure over the substrate, wherein the gate structure partially covers the second portion of the isolation feature.
Public/Granted literature
- US20180233522A1 SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME Public/Granted day:2018-08-16
Information query
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