Invention Grant
- Patent Title: Semiconductor device and manufacturing method thereof
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Application No.: US15795519Application Date: 2017-10-27
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Publication No.: US10535737B2Publication Date: 2020-01-14
- Inventor: Fang-Liang Lu , Chia-Che Chung , Yu-Jiun Peng , Chee-Wee Liu
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. , NATIONAL TAIWAN UNIVERSITY
- Applicant Address: TW Hsinchu TW Taipei
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.,NATIONAL TAIWAN UNIVERSITY
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.,NATIONAL TAIWAN UNIVERSITY
- Current Assignee Address: TW Hsinchu TW Taipei
- Agency: McClure, Qualey & Rodack, LLP
- Main IPC: H01L27/12
- IPC: H01L27/12 ; H01L29/10 ; H01L29/66 ; H01L29/78

Abstract:
A semiconductor device includes a substrate, a channel structure, and a gate structure. The channel structure is over the substrate and extends along a first direction, in which the channel structure has plurality of first portions and plurality of second portions alternately stacked, and a width of the first portions is smaller than that of the second portions in a second direction different from the first direction. The gate structure is disposed over the substrate and crossing the channel structure along the second direction, in which the gate structure is in contact with the first portions and the second portions.
Public/Granted literature
- US20190131403A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2019-05-02
Information query
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