Invention Grant
- Patent Title: Metal gate structure and methods thereof
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Application No.: US16044227Application Date: 2018-07-24
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Publication No.: US10535746B2Publication Date: 2020-01-14
- Inventor: Tzung-Chi Lee , Tung-Heng Hsieh , Bao-Ru Young , Chia-Sheng Fan
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Haynes and Boone, LLP
- Main IPC: H01L29/49
- IPC: H01L29/49 ; H01L21/8238 ; H01L21/8234 ; H01L29/51 ; H01L21/84 ; H01L29/66

Abstract:
Provided is a metal gate structure and related methods that include forming a first fin and a second fin on a substrate. In various embodiments, the first fin has a first gate region and the second fin has a second gate region. By way of example, a metal-gate line is formed over the first and second gate regions. In some embodiments, the metal-gate line extends from the first fin to the second fin, and the metal-gate line includes a sacrificial metal portion. In various examples, a line-cut process is performed to separate the metal-gate line into a first metal gate line and a second gate line. In some embodiments, the sacrificial metal portion prevents lateral etching of a dielectric layer during the line-cut process.
Public/Granted literature
- US20180331199A1 METAL GATE STRUCTURE AND METHODS THEREOF Public/Granted day:2018-11-15
Information query
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