An electrical connector for electrically connecting a chip module to a circuit board includes an insulating body, and a plurality of terminals. Each of the terminals has a base accommodated in the insulating body and a mating portion contacting a conductive sheet of the chip module. A plurality of supporting portions extend upward from an upper surface of the insulating body, and an upper end of each of the supporting portions is provided with a crumple portion located below the mating portion of one of the terminals. The chip module is mounted on the electrical connector, the conductive sheet presses the mating portion, the mating portion abuts the crumple portion, and the crumple portion is pressed so that a height of the crumple portion is decreased.