Invention Grant
- Patent Title: Power supply device, semiconductor integrated circuit, and method for suppressing ripple component
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Application No.: US16231538Application Date: 2018-12-23
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Publication No.: US10536082B2Publication Date: 2020-01-14
- Inventor: Daisuke Imade , Naoto Endo
- Applicant: Daisuke Imade , Naoto Endo
- Applicant Address: JP Tokyo
- Assignee: MITSUMI ELECTRIC CO., LTD.
- Current Assignee: MITSUMI ELECTRIC CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Holtz, Holtz & Volek PC
- Priority: JP2017-252780 20171228; JP2018-211614 20181109
- Main IPC: H02M1/15
- IPC: H02M1/15 ; H02M3/335 ; H03K5/24 ; H05B33/08 ; G01R19/165 ; H02M1/00

Abstract:
A power supply device includes a voltage conversion circuit, a current controller and a current controlling circuit. The voltage conversion circuit generates a DC voltage from an AC power source and outputs the DC voltage to a pair of output terminals. The current controller is disposed on a first current path through which an output current flows and controls the current in the first current path. The current controlling circuit drives the current controller so as to reduce a ripple component generated in the output current, based on (i) a voltage at a first potential point set on a path from an output terminal at a high-potential side of the voltage conversion circuit to the current controller in the first current path and (ii) a current detecting voltage indicating the magnitude of the output current.
Public/Granted literature
- US20190207520A1 POWER SUPPLY DEVICE, SEMICONDUCTOR INTEGRATED CIRCUIT, AND METHOD FOR SUPPRESSING RIPPLE COMPONENT Public/Granted day:2019-07-04
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