- Patent Title: Overlapping cluster architecture for coordinated multipoint (CoMP)
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Application No.: US15684823Application Date: 2017-08-23
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Publication No.: US10536195B2Publication Date: 2020-01-14
- Inventor: Jing Sun , Xiaoxia Zhang , Taesang Yoo , Siddhartha Mallik , Juan Montojo
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Patterson & Sheridan, LLP
- Main IPC: H04H20/71
- IPC: H04H20/71 ; H04B7/024 ; H04L12/715 ; H04B17/318 ; H04B7/06 ; H04L5/00 ; H04W56/00

Abstract:
Techniques for overlapping cluster architecture for coordinated multipoint (CoMP) are provided. According to certain aspects, a method of wireless communication by a transmission point is provided. The method generally includes receiving, from a first base station, a first signal for a first user equipment (UE) to transmit over the air, receiving, from a second base station, a second signal for a second UE to transmit over the air, and combining the first and the second signals from the first and second base stations and transmitting the combined signal to the first and second UE.
Public/Granted literature
- US20180062708A1 OVERLAPPING CLUSTER ARCHITECTURE FOR COORDINATED MULTIPOINT (COMP) Public/Granted day:2018-03-01
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