An electronic device includes a first integrated circuit die having formed therein photodiodes and readout circuitry for the photodiodes, with the readout circuitry including output pads exposed on a surface of the first integrated circuit die. A second integrated circuit die has formed therein storage capacitor structures for the photodiodes and digital circuitry for performing image processing on data stored in the storage capacitor structures, with the storage capacitor structures including input pads exposed on a surface of the second integrated circuit die. The first and second integrated circuit die are in a face to face arrangement such that the output pads of the first integrated circuit die face the input pads of the second integrated circuit die. An interconnect couples the output pads of the first integrated circuit die to the input pads of the second integrated circuit die.