- Patent Title: Heat dissipating component, manufacturing method for heat dissipating component, electronic device, manufacturing method for electronic device, integrated module, and information processing system
-
Application No.: US15215174Application Date: 2016-07-20
-
Publication No.: US10537044B2Publication Date: 2020-01-14
- Inventor: Takashi Suzuki , Kanae Nakagawa
- Applicant: FUJITSU LIMITED
- Applicant Address: JP Kawasaki
- Assignee: FUJITSU LIMITED
- Current Assignee: FUJITSU LIMITED
- Current Assignee Address: JP Kawasaki
- Agency: Kratz, Quintos & Hanson, LLP
- Priority: JP2014-008950 20140121
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H01L23/36 ; H01L23/433 ; G08G1/042 ; H01L23/31 ; H01L21/56 ; H01L21/48 ; H01L23/367 ; H01L23/373 ; H01L23/00 ; H01L35/02
Abstract:
A heat dissipating component comprising: a main body formed from a first material; a heat dissipating sheet that is formed from a second material having higher thermal conductivity than the first material, that is provided at the main body, and that includes a plurality of fins thermally connected to each other at positions other than apexes and a connecting portion thermally connecting the plurality of fins to an electronic component; and a covering portion that covers at least a portion of a bottom portion of a groove between the plurality of fins.
Public/Granted literature
Information query
