Invention Grant
- Patent Title: Module installation alignment device
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Application No.: US15170996Application Date: 2016-06-02
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Publication No.: US10537050B2Publication Date: 2020-01-14
- Inventor: Ryan N. Elsasser , Brian E. Hanrahan , Steven J. James , Oswald J. Mantilla , Enrico A. Romano , Yuet-Ying Yu
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Cantor Colburn LLP
- Agent Tihon Poltavets
- Main IPC: H05K13/04
- IPC: H05K13/04 ; H01R43/20 ; H05K13/00 ; H05K7/10

Abstract:
A module installation assembly for installing a module into a socket of a land grid array includes a tool having a mounting bracket for connecting the tool to an adjacent fixture, an alignment member connected to the mounting bracket, and cavity defined at least partially by the alignment member. The cavity is substantially aligned with a socket of the land grid array such that the module is configured to pass through the cavity when being connected to the socket.
Public/Granted literature
- US20170354072A1 MODULE INSTALLATION ALIGNMENT DEVICE Public/Granted day:2017-12-07
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