Invention Grant
- Patent Title: Laser processing method for plate-shaped workpiece
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Application No.: US14966261Application Date: 2015-12-11
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Publication No.: US10537967B2Publication Date: 2020-01-21
- Inventor: Hirokazu Matsumoto , Saki Kimura
- Applicant: DISCO CORPORATION
- Applicant Address: JP Tokyo
- Assignee: DISCO CORPORATION
- Current Assignee: DISCO CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Greer Burns & Crain, Ltd.
- Priority: JP2014-259740 20141224
- Main IPC: B23K26/38
- IPC: B23K26/38

Abstract:
A laser processing method includes a supporting step of attaching an adhesive tape to an annular frame having an opening for accommodating the plate-shaped workpiece and attaching the plate-shaped workpiece to the adhesive tape. The adhesive tape is composed of a base film, an adhesive layer formed on one side of the base film, and a functional layer formed on the other side of the base film. The functional layer includes fine particles of metal oxide, emulsion particles of thermoplastic resin as a binder, and a dispersing medium. The laser processing method further includes a laser processed groove forming step of applying a laser beam from a laser beam applying unit to the plate-shaped workpiece held on the chuck table and relatively feeding the chuck table and the laser beam applying unit by operating a feeding unit, thereby forming the laser processed groove on the plate-shaped workpiece.
Public/Granted literature
- US20160184934A1 LASER PROCESSING METHOD FOR PLATE-SHAPED WORKPIECE Public/Granted day:2016-06-30
Information query
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