Invention Grant
- Patent Title: CMP pad construction with composite material properties using additive manufacturing processes
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Application No.: US15876436Application Date: 2018-01-22
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Publication No.: US10537974B2Publication Date: 2020-01-21
- Inventor: Rajeev Bajaj , Kasiraman Krishnan , Mahendra C. Orilall , Daniel Redfield , Fred C. Redeker , Nag B. Patibandla , Gregory E. Menk , Jason G. Fung , Russell Edward Perry , Robert E. Davenport
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson + Sheridan LLP
- Main IPC: B24D18/00
- IPC: B24D18/00 ; B24B37/26 ; B24B37/24 ; B33Y80/00 ; B24B37/20 ; B24B37/22 ; B29C64/112

Abstract:
Embodiments of the disclosure generally provide polishing pads includes a composite pad body and methods for forming the polishing pads. One embodiment provides a polishing pad including a composite pad body. The composite pad body includes one or more first features formed from a first material or a first composition of materials, and one or more second features formed from a second material or a second composition of materials, wherein the one or more first features and the one or more second features are formed by depositing a plurality of layers comprising the first material or first composition of materials and second material or second composition of materials.
Public/Granted literature
- US20180161954A1 CMP PAD CONSTRUCTION WITH COMPOSITE MATERIAL PROPERTIES USING ADDITIVE MANUFACTURING PROCESSES Public/Granted day:2018-06-14
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