- Patent Title: Substrate adsorption method, substrate holding apparatus, substrate polishing apparatus, elastic film, substrate adsorption determination method for substrate holding apparatus, and pressure control method for substrate holding apparatus
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Application No.: US15234058Application Date: 2016-08-11
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Publication No.: US10537975B2Publication Date: 2020-01-21
- Inventor: Hiroyuki Shinozaki , Makoto Fukushima , Osamu Nabeya
- Applicant: Ebara Corporation
- Applicant Address: JP Tokyo
- Assignee: Ebara Corporation
- Current Assignee: Ebara Corporation
- Current Assignee Address: JP Tokyo
- Agency: Leydig, Voit & Mayer, Ltd.
- Priority: JP2015-161187 20150818; JP2016-097291 20160513; JP2016-134881 20160707
- Main IPC: B24B49/10
- IPC: B24B49/10 ; B24B37/30 ; B24B37/11 ; H01L21/683 ; H01L21/67 ; H01L21/306

Abstract:
A method includes: vacuuming at least one area among a plurality of areas formed concentrically between a top face of the elastic film and the top ring body under a state where a bottom face of the substrate is supported by a support member and a top face of the substrate contacts a bottom face of the elastic film; measuring a flow volume of gas in an area located outside one or more areas to be vacuumed; determining whether the substrate is adsorbed to the top ring based on the flow volume of the gas; and after it is determined that the substrate is adsorbed to the top ring, separating the elastic film to which the substrate is adsorbed from the support member.
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