Invention Grant
- Patent Title: Heat-dissipating film, and its production method and apparatus
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Application No.: US16125364Application Date: 2018-09-07
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Publication No.: US10538054B2Publication Date: 2020-01-21
- Inventor: Seiji Kagawa
- Applicant: Seiji Kagawa
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2013-167925 20130812
- Main IPC: B32B5/16
- IPC: B32B5/16 ; C01B32/05 ; B32B27/28 ; B32B9/00 ; B29D7/01 ; B32B27/06 ; B32B9/04 ; B32B5/30 ; B32B27/30 ; B32B27/36 ; C09K5/14 ; B32B3/04 ; B32B27/34 ; B32B27/32 ; B32B27/14 ; H01L23/373 ; B32B27/18 ; B32B27/24 ; B32B38/10 ; B32B37/22 ; B32B37/02 ; B32B37/10 ; B32B37/06 ; B32B37/24

Abstract:
A heat-dissipating film comprising a heat-conductive layer obtained by burning a mixture layer of flaky carbon and a binder resin to carbonize or burn off the binder resin, and plastic films covering the heat-conductive layer, the heat-conductive layer having a density of 1.9 g/cm3 or more and thermal conductivity of 450 W/mK or more, is produced by (1) sandwiching a mixture layer of flaky carbon and a binder resin with a pair of first plastic films to form a laminated film; (2) heat-pressing the laminated film to densify the mixture layer; (3) burning the mixture layer to carbonize the binder resin in the mixture layer; (4) pressing the resultant burnt layer to form the heat-conductive layer; and (5) sealing the heat-conductive layer with second plastic films.
Public/Granted literature
- US20190001616A1 HEAT-DISSIPATING FILM, AND ITS PRODUCTION METHOD AND APPARATUS Public/Granted day:2019-01-03
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