Invention Grant
- Patent Title: Thermosetting resin composition
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Application No.: US16205681Application Date: 2018-11-30
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Publication No.: US10538610B2Publication Date: 2020-01-21
- Inventor: Yuya Moriwaki , Kosuke Asada , Masaru Donkai
- Applicant: KYOEISHA CHEMICAL CO., LTD.
- Applicant Address: JP Osaka
- Assignee: KYOEISHA CHEMICAL CO., LTD.
- Current Assignee: KYOEISHA CHEMICAL CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: Ladas & Parry LLP
- Agent Malcolm J. MacDonald
- Main IPC: C08F220/18
- IPC: C08F220/18 ; C09D133/10 ; C09J133/10

Abstract:
A thermosetting resin composition using a transesterification reaction as a curing reaction, which has a good curability and can be used in various applications. A thermosetting resin composition comprising a polymer (A) composed of a monomer having a (meth) acrylic acid tertiary alkyl ester and a monomer having a hydroxyl group as a structural unit, and a transesterification catalyst (B) as an essential component, and being organic solvent-type or water-borne, wherein the polymer (A) has a glass transition temperature of 80° C. or lower.
Public/Granted literature
- US20190092889A1 THERMOSETTING RESIN COMPOSITION Public/Granted day:2019-03-28
Information query
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