Invention Grant
- Patent Title: Polyimide resin, thin film and method for manufacturing thereof
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Application No.: US15645594Application Date: 2017-07-10
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Publication No.: US10538626B2Publication Date: 2020-01-21
- Inventor: Bo-Hung Lai , Wei-Ming Hou , Tang-Chieh Huang
- Applicant: Microcosm Technology Co. Ltd.
- Applicant Address: TW Tainan
- Assignee: Microcosm Technology Co., Ltd
- Current Assignee: Microcosm Technology Co., Ltd
- Current Assignee Address: TW Tainan
- Agency: Haverstock & Owens LLP
- Priority: TW106104879A 20170215
- Main IPC: C08G73/10
- IPC: C08G73/10 ; C08J5/18 ; C09D179/08

Abstract:
A transparent and colorless polyimide resin is provided. The polyimide resin is derived from at least two dianhydride monomers and at least two diamine monomers. At least one monomer in the dianhydride and diamine monomers includes structure of formula (1). The monomer with structure of formula (1) has an amount of moles accounting for 10-50% of total moles of the dianhydride or diamine monomers. In formula (1), X is SO2,C(CH3)2 or C(CF3)2, Y is oxygen.
Public/Granted literature
- US20180230270A1 POLYIMIDE RESIN, THIN FILM AND METHOD FOR MANUFACTURING THEREOF Public/Granted day:2018-08-16
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